Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10497635 | Stacked circuit package with molded base having laser drilled openings for upper package | John David Brazzle, Frederick E. Beville, David R. Ng, Michael J. Anderson | 2019-12-03 |