Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10294341 | Thermosetting resin composition for semiconductor package and prepreg using the same | Hwa Yeon Moon, Yong Seon Hwang, Hee Yong Shim, Hyun Sung Min, Chang Bo Shim +3 more | 2019-05-21 |
| 10187335 | Methods, systems and computer readable mediums for providing a rich menu for instant messaging services | Do Hun Im, Young Su Ko, Yusuke Ota | 2019-01-22 |