Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10294341 | Thermosetting resin composition for semiconductor package and prepreg using the same | Yong Seon Hwang, Hee Yong Shim, Hyun Sung Min, Mi Seon Kim, Chang Bo Shim +3 more | 2019-05-21 |