Issued Patents 2019
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522786 | Organic electronic device having dimension tolerance between encapsulating layer and metal layer less than or equal to 200 microns | Hyun Jee Yoo, Seung Min Lee, Hyun Suk Kim, Jung Ok Moon | 2019-12-31 |
| 10457842 | Curable composition | Yoon Gyung Cho, Hyun Jee Yoo, Seung Min Lee, Jung Sup Shim | 2019-10-29 |
| 10435596 | Pressure-sensitive adhesive composition | Yoon Gyung Cho, Hyun Jee Yoo, Kyung Yul Bae, Jung Sup Shim | 2019-10-08 |
| 10403850 | Encapsulation film and method for encapsulating organic electronic device using same | Hyun Jee Yoo, Seung Min Lee, Hyun Suk Kim, Jung Ok Moon | 2019-09-03 |
| 10392536 | Pressure-sensitive adhesive composition, pressure-sensitive adhesive film, and method of manufacturing organic electronic device using the same | Kyung Yul Bae, Hyun Jee Yoo, Yoon Gyung Cho | 2019-08-27 |
| 10316222 | Conductive laminate, and touch panel comprising same | Min Soo Park, Se Woo Yang | 2019-06-11 |
| 10254458 | Laminate | Se Woo Yang, Sung Hyun Nam, Yoon Tae Hwang, Jong Hyun Jung, Kyun Il Rah | 2019-04-09 |
| 10243233 | Swelling tape for filling gap | Min Soo Park, Byung Kyu Jung, Yoon Tae Hwang, Se Woo Yang, Sung Jong Kim +2 more | 2019-03-26 |
| 10227514 | Adhesive film | Hyun Jee Yoo, Yoon Gyung Cho, Jung Sup Shim | 2019-03-12 |
| 10230084 | Swelling tape for filling gap | Se Ra Kim, Hyo Sook Joo, Yoon Tae Hwang, Se Woo Yang, Joon-Hyung Kim +1 more | 2019-03-12 |