HY

Hyun Jee Yoo

LG: 15 patents #144 of 5,718Top 3%
Overall (2019): #3,849 of 560,194Top 1%
15
Patents 2019

Issued Patents 2019

Showing 1–15 of 15 patents

Patent #TitleCo-InventorsDate
10522786 Organic electronic device having dimension tolerance between encapsulating layer and metal layer less than or equal to 200 microns Seung Min Lee, Hyun Suk Kim, Suk Ky Chang, Jung Ok Moon 2019-12-31
10497904 Display device Hyun Suk Kim, Se Woo Yang, Hyun Hee Son, Jung Ok Moon, Hyoung Sook Park +2 more 2019-12-03
10457842 Curable composition Yoon Gyung Cho, Seung Min Lee, Suk Ky Chang, Jung Sup Shim 2019-10-29
10442960 Adhesive film and organic electronic device comprising the same Kyung Yul Bae, Yoon Gyung Cho, Se Woo Yang 2019-10-15
10435596 Pressure-sensitive adhesive composition Yoon Gyung Cho, Kyung Yul Bae, Suk Ky Chang, Jung Sup Shim 2019-10-08
10403850 Encapsulation film and method for encapsulating organic electronic device using same Seung Min Lee, Hyun Suk Kim, Suk Ky Chang, Jung Ok Moon 2019-09-03
10392536 Pressure-sensitive adhesive composition, pressure-sensitive adhesive film, and method of manufacturing organic electronic device using the same Kyung Yul Bae, Yoon Gyung Cho, Suk Ky Chang 2019-08-27
10385237 Organic electronic device Kyung Yul Bae, Se Woo Yang, Yoon Gyung Cho, Sang Min Park 2019-08-20
10351738 Pressure-sensitive adhesive film and method of manufacturing organic electronic device using the same Kyung Yul Bae, Yoon Gyung Cho, Se Woo Yang 2019-07-16
10355239 Encapsulation film Hyun Suk Kim, Jung Ok Moon, Se Woo Yang 2019-07-16
10336917 Pressure-sensitive adhesive film and method of manufacturing organic electronic device using the same Yoon Gyung Cho, Kyung Yul Bae 2019-07-02
10308842 Pressure-sensitive adhesive composition, pressure-sensitive adhesive film, and method of manufacturing organic electronic device using the same Yoon Gyung Cho, Kyung Yul Bae, Min Soo Park, Jung Sup Shim 2019-06-04
10227514 Adhesive film Yoon Gyung Cho, Suk Ky Chang, Jung Sup Shim 2019-03-12
10202525 Pressure sensitive adhesive composition, pressure sensitive adhesive film, and method of manufacturing organic electronic device using the same Sang Min Park, Yoon Gyung Cho, Kyung Yul Bae, Jung Sup Shim, Min Soo Park 2019-02-12
10181577 Encapsulation film and organic electronic device comprising the same Ban Seok Choi, Hyun Suk Kim, Seung Min Lee, Jung Ok Moon, Se Woo Yang 2019-01-15