Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10508351 | Layer-by-layer deposition using hydrogen | Aniruddha Joi | 2019-12-17 |
| 10501846 | Electrochemical doping of thin metal layers employing underpotential deposition and thermal treatment | Kailash Venkatraman, Aniruddha Joi | 2019-12-10 |
| 10483163 | Self-forming barrier process | Aniruddha Joi | 2019-11-19 |
| 10262943 | Interlevel conductor pre-fill utilizing selective barrier deposition | Artur Kolics, William T. Lee, Larry Zhao, Derek Wong, Praveen Nalla +2 more | 2019-04-16 |