Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10509052 | Smart vibration wafer with optional integration with semiconductor processing tool | Arulselvam Simon Jeyapalan, Richard M. Blank, Tyson Ringold, Victor Eduardo Espinosa, III | 2019-12-17 |