Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10170403 | Ameliorated compound carrier board structure of flip-chip chip-scale package | Ting-Hao Lin, Chiao-Cheng Chang | 2019-01-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10170403 | Ameliorated compound carrier board structure of flip-chip chip-scale package | Ting-Hao Lin, Chiao-Cheng Chang | 2019-01-01 |