Issued Patents 2019
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10440837 | Manufacturing method of double layer circuit board | Ting-Hao Lin, Yi-Nong Lin | 2019-10-08 |
| 10440836 | Double layer circuit board | Ting-Hao Lin, Yi-Nong Lin | 2019-10-08 |
| 10405423 | Multi-layer circuit board | Ting-Hao Lin, Yi-Nong Lin | 2019-09-03 |
| 10383265 | Electromagnetic-interference shielding device | Ting-Hao Lin, Yung-Lin Chia | 2019-08-13 |
| 10371719 | Printed circuit board circuit test fixture with adjustable density of test probes mounted thereon | Ting-Hao Lin, Yi-Nong Lin | 2019-08-06 |
| 10366822 | Method of manufacturing winged coil structure | Ting-Hao Lin, Yi-Nong Lin | 2019-07-30 |
| 10256030 | Flexible plate adapted to be used in winged coil structure, winged coil structure, and method of manufacturing winged coil structure | Ting-Hao Lin, Yi-Nong Lin | 2019-04-09 |
| 10256028 | Buildup board structure | Ting-Hao Lin, Yi-Nong Lin | 2019-04-09 |
| 10170403 | Ameliorated compound carrier board structure of flip-chip chip-scale package | Ting-Hao Lin, Yi-Nung Lin | 2019-01-01 |