Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10410794 | Multilayer ceramic structure | — | 2019-09-10 |
| 10381162 | Leadless stack comprising multiple components | John E. McConnell, Garry L. Renner, R. Allen Hill, Galen W. Miller | 2019-08-13 |
| 10366836 | Electronic component structures with reduced microphonic noise | John E. McConnell, Galen W. Miller | 2019-07-30 |
| 10224149 | Bulk MLCC capacitor module | Galen W. Miller, John E. McConnell, Garry L. Renner | 2019-03-05 |
| 10178770 | Higher density multi-component and serial packages | James A. Burk, Galen W. Miller | 2019-01-08 |