Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10381162 | Leadless stack comprising multiple components | John E. McConnell, Garry L. Renner, John Bultitude, R. Allen Hill | 2019-08-13 |
| 10366836 | Electronic component structures with reduced microphonic noise | John Bultitude, John E. McConnell | 2019-07-30 |
| 10224149 | Bulk MLCC capacitor module | John E. McConnell, John Bultitude, Garry L. Renner | 2019-03-05 |
| 10178770 | Higher density multi-component and serial packages | James A. Burk, John Bultitude | 2019-01-08 |