Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10438873 | Semiconductor chip package having heat dissipating structure | Jeonghun Cho | 2019-10-08 |
| 10256207 | Clip-bonded semiconductor chip package using metal bumps and method for manufacturing the package | — | 2019-04-09 |
| 10204848 | Semiconductor chip package having heat dissipating structure | Jeonghun Cho | 2019-02-12 |