Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10438873 | Semiconductor chip package having heat dissipating structure | Yunhwa Choi | 2019-10-08 |
| 10204848 | Semiconductor chip package having heat dissipating structure | Yunhwa Choi | 2019-02-12 |