Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10368433 | Multi-layer circuit member with reference planes and ground layer surrounding and separating conductive signal pads | Chin-Yu Chen, Cheng-Wen Chen, Ke-Hao Chen | 2019-07-30 |
| 10361519 | Board to board connector assembly with sandwiching type shielding plate set | — | 2019-07-23 |
| 10312637 | Electrical connector having seamless shielding shell and single row of contacts | — | 2019-06-04 |