Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10368433 | Multi-layer circuit member with reference planes and ground layer surrounding and separating conductive signal pads | Chin-Yu Chen, Shun-Jung Chuang, Ke-Hao Chen | 2019-07-30 |