Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10290676 | Superconducting device with thermally conductive heat sink | Aaron A. Pesetski | 2019-05-14 |
| 10229864 | Cryogenic integrated circuit having a heat sink coupled to separate ground planes through differently sized thermal vias | Robert M. Young, Daniel R. Queen, Aaron Ashley Hathaway, John X. Przybysz | 2019-03-12 |