Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10229864 | Cryogenic integrated circuit having a heat sink coupled to separate ground planes through differently sized thermal vias | Patrick Alan Loney, Robert M. Young, Daniel R. Queen, John X. Przybysz | 2019-03-12 |