Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483191 | Bottom package exposed die MEMS pressure sensor integrated circuit package design | Aaron Cadag, Ernesto Antilano, Jr. | 2019-11-19 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483191 | Bottom package exposed die MEMS pressure sensor integrated circuit package design | Aaron Cadag, Ernesto Antilano, Jr. | 2019-11-19 |