Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483191 | Bottom package exposed die MEMS pressure sensor integrated circuit package design | Frederick Arellano, Ernesto Antilano, Jr. | 2019-11-19 |
| 10461019 | Package with backside protective layer during molding to prevent mold flashing failure | Ian Harvey Arellano, Ela Mia Cadag | 2019-10-29 |