Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10269639 | Method of manufacturing packaged wafer | Hideki Koshimizu, Yurika Araya | 2019-04-23 |
| 10262899 | Method of processing wafer | Atsushi Kubo | 2019-04-16 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10269639 | Method of manufacturing packaged wafer | Hideki Koshimizu, Yurika Araya | 2019-04-23 |
| 10262899 | Method of processing wafer | Atsushi Kubo | 2019-04-16 |