Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483241 | Semiconductor devices with through silicon vias and package-level configurability | Kevin G. Duesman, James E. Davis | 2019-11-19 |
| 10403585 | Semiconductor devices with post-probe configurability | James E. Davis, Kevin G. Duesman, Jeffrey P. Wright | 2019-09-03 |
| 10283462 | Semiconductor devices with post-probe configurability | James E. Davis, Kevin G. Duesman, Jeffrey P. Wright | 2019-05-07 |