Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10429414 | Multiple contact probe head disassembly method and system | Marvin Montaque, David L. Gardell | 2019-10-01 |
| 10309884 | Predicting semiconductor package warpage | Eric G. Liniger, Travis S. Longenbach | 2019-06-04 |
| 10256204 | Separation of integrated circuit structure from adjacent chip | Glen E. Richard, Hanyi Ding | 2019-04-09 |
| 10245667 | Chip joining by induction heating | Glen E. Richard, Timothy D. Sullivan, Timothy M. Sullivan | 2019-04-02 |
| 10200016 | Contactless readable programmable transponder to monitor chip join | Shawn P. Fetterolf, Adam J. McPadden, Timothy M. Sullivan | 2019-02-05 |