Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504881 | Stacked semiconductor die assemblies with support members and associated systems and methods | Hong Wan Ng | 2019-12-10 |
| 10431513 | Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices | Chin Hui Chong, Choon Kuan Lee, Wang Lai Lee, Roslan Bin Said | 2019-10-01 |
| 10304808 | Semiconductor devices including a controller and methods of forming such devices | Hong Wan Ng | 2019-05-28 |