Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10340306 | Semiconductor package with chamfered corners and related methods | — | 2019-07-02 |
| 10290672 | Image sensor semiconductor packages and related methods | Larry D. Kinsman, Yusheng LIN, Yu-Te HSIEH, Weng-Jin Wu, Chi-Yao Kuo | 2019-05-14 |