Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510703 | Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package | HeeJo Chi, HanGil Shin | 2019-12-17 |
| 10397773 | Method and apparatus for allocating IP address in wireless communication network | Jongmu Choi, Changsoon Kim, Hakkwan Kim | 2019-08-27 |