Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510703 | Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package | HanGil Shin, NamJu Cho | 2019-12-17 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510703 | Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package | HanGil Shin, NamJu Cho | 2019-12-17 |