Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446431 | Temporary carrier debond initiation, and associated systems and methods | — | 2019-10-15 |
| 10403618 | Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topography | Chandra S. Tiwari, Tony M. Lindenberg, Christopher J. Gambee, Kurt J. Bossart | 2019-09-03 |
| 10396052 | Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technology | — | 2019-08-27 |
| 10262961 | Semiconductor devices having discretely located passivation material, and associated systems and methods | Mayukhee Das, Christopher J. Gambee, Chandra S. Tiwari | 2019-04-16 |