Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10403618 | Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topography | Chandra S. Tiwari, Tony M. Lindenberg, Jonathan S. Hacker, Kurt J. Bossart | 2019-09-03 |
| 10332792 | Methods of fabricating conductive traces and resulting structures | — | 2019-06-25 |
| 10262961 | Semiconductor devices having discretely located passivation material, and associated systems and methods | Mayukhee Das, Jonathan S. Hacker, Chandra S. Tiwari | 2019-04-16 |