Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504842 | Semiconductor device including superconducting metal through-silicon-vias | David W. Abraham | 2019-12-10 |
| 10347600 | Through-substrate-vias with self-aligned solder bumps | David W. Abraham | 2019-07-09 |
| 10325870 | Through-substrate-vias with self-aligned solder bumps | David W. Abraham | 2019-06-18 |
| 10308506 | Use of a reactive, or reducing gas as a method to increase contact lifetime in micro contact mems switch devices | Nils D. Hoivik, Christopher V. Jahnes | 2019-06-04 |
| 10199516 | Method for fabricating a photovoltaic device by uniform plating on dielectric passivated through-wafer vias and interconnects | Brett C. Baker-O'Neal, Shu-Yun Chong, Ronald D. Goldblatt, Jeffrey Hedrick, Qiang Huang +4 more | 2019-02-05 |
| 10170817 | Superconducting airbridge crossover using superconducting sacrificial material | Josephine B. Chang | 2019-01-01 |