Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10199516 | Method for fabricating a photovoltaic device by uniform plating on dielectric passivated through-wafer vias and interconnects | Shu-Yun Chong, John M. Cotte, Ronald D. Goldblatt, Jeffrey Hedrick, Qiang Huang +4 more | 2019-02-05 |