Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10260961 | Integrated circuit packages with temperature sensor traces | Shelby Ferguson, Rashelle Kay Yee, Russell S. Aoki, Michael Hui, Joseph J. Jasniewski | 2019-04-16 |
| 10178763 | Warpage mitigation in printed circuit board assemblies | Rashelle Kay Yee, Russell S. Aoki, Shelby Ferguson, Michael Hui, Joseph J. Jasniewski +1 more | 2019-01-08 |