Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10260961 | Integrated circuit packages with temperature sensor traces | Shelby Ferguson, Russell S. Aoki, Michael Hui, Jonathon Robert Carstens, Joseph J. Jasniewski | 2019-04-16 |
| 10178763 | Warpage mitigation in printed circuit board assemblies | Russell S. Aoki, Shelby Ferguson, Michael Hui, Jonathon Robert Carstens, Joseph J. Jasniewski +1 more | 2019-01-08 |