Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10256120 | Systems, methods and apparatus for post-chemical mechanical planarization substrate buff pre-cleaning | Clinton SAKATA, Hui Chen, Brian J. Brown, Jianshe Tang, Yufei Chen +1 more | 2019-04-09 |
| 10229842 | Double sided buff module for post CMP cleaning | Clinton SAKATA, Hui Chen, Tomohiko Kitajima, Brian J. Brown | 2019-03-12 |