Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515853 | Method of wafer dicing | Ching-Wei Chen, Cheng-Hong Wei, Shuo-Che Chang, Hung-Sheng Chen | 2019-12-24 |
| 10483235 | Stacked electronic device and method for fabricating the same | Yu-Cheng Chiao, Tung-Yi Chan, Chen-Hsi Lin, Chia-Hua Ho, Meng-Chang Chan | 2019-11-19 |