Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515853 | Method of wafer dicing | Cheng-Hong Wei, Shuo-Che Chang, Hung-Sheng Chen, Hsin-Hung Chou | 2019-12-24 |
| 10386484 | Optical apparatus and light sensitive device with micro-lens | En-Feng Hsu, Chia-Yu Liu | 2019-08-20 |