Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10468384 | Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same | DeokKyung Yang, HunTeak Lee, Sungsoo Kim | 2019-11-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10468384 | Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same | DeokKyung Yang, HunTeak Lee, Sungsoo Kim | 2019-11-05 |