Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446356 | Multilayer printed circuit board via hole registration and accuracy | Shinichi Iketani | 2019-10-15 |
| 10188001 | Methods of forming high aspect ratio plated through holes and high precision stub removal in a printed circuit board | Shinichi Iketani, Dale Kersten | 2019-01-22 |