Issued Patents 2019
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10395067 | Method of fabricating a tamper-respondent sensor assembly | William L. Brodsky, John R. Dangler, Phillip Duane Isaacs, Michael T. Peets | 2019-08-27 |
| 10378925 | Circuit boards and electronic packages with embedded tamper-respondent sensor | William L. Brodsky, Silvio Dragone, Roger S. Krabbenhoft, Stefano S. Oggioni, Michael T. Peets +1 more | 2019-08-13 |
| 10378924 | Circuit boards and electronic packages with embedded tamper-respondent sensor | William L. Brodsky, Silvio Dragone, Roger S. Krabbenhoft, Stefano S. Oggioni, Michael T. Peets +1 more | 2019-08-13 |
| 10334722 | Tamper-respondent assemblies | William L. Brodsky, James A. Busby, Phillip Duane Isaacs | 2019-06-25 |
| 10331915 | Overlapping, discrete tamper-respondent sensors | William L. Brodsky, John R. Dangler, Phillip Duane Isaacs, Michael T. Peets | 2019-06-25 |
| 10327329 | Tamper-respondent assembly with flexible tamper-detect sensor(s) overlying in-situ-formed tamper-detect sensor | William L. Brodsky, James A. Busby, John R. Dangler, Silvio Dragone, Michael J. Fisher | 2019-06-18 |
| 10327343 | Applying pressure to adhesive using CTE mismatch between components | Michael J. Fisher, Donald A. Merte, Robert Weiss, Thomas Weiss | 2019-06-18 |
| 10306753 | Enclosure-to-board interface with tamper-detect circuit(s) | Kathleen Ann Fadden, James A. Busby, John R. Dangler, Alexandra Echegaray, Michael J. Fisher +1 more | 2019-05-28 |
| 10271434 | Method of fabricating a tamper-respondent assembly with region(s) of increased susceptibility to damage | John R. Dangler, Michael T. Peets | 2019-04-23 |
| 10264665 | Tamper-respondent assemblies with bond protection | William L. Brodsky, James A. Busby, Zachary Thomas Dreiss, Michael J. Fisher, William Santiago-Fernandez +1 more | 2019-04-16 |
| 10257924 | Tamper-proof electronic packages formed with stressed glass | James A. Busby, Silvio Dragone, Michael J. Fisher, Michael A. Gaynes, Kenneth P. Rodbell +2 more | 2019-04-09 |
| 10257939 | Method of fabricating tamper-respondent sensor | John R. Dangler, Phillip Duane Isaacs | 2019-04-09 |
| 10251288 | Tamper-respondent assembly with vent structure | Michael J. Fisher, Michael T. Peets, Robert Weiss, Thomas Weiss, James Edward Tersigni | 2019-04-02 |
| 10242931 | Liquid cooled compliant heat sink and related method | Raschid J. Bezama, Govindarajan Natarajan, Thomas Weiss | 2019-03-26 |
| 10175064 | Circuit boards and electronic packages with embedded tamper-respondent sensor | William L. Brodsky, Silvio Dragone, Roger S. Krabbenhoft, Stefano S. Oggioni, Michael T. Peets +1 more | 2019-01-08 |
| 10178818 | Enclosure with inner tamper-respondent sensor(s) and physical security element(s) | Michael J. Fisher, Michael T. Peets, Thomas Weiss | 2019-01-08 |
| 10177075 | Liquid cooled compliant heat sink and related method | Raschid J. Bezama, Govindarajan Natarajan, Thomas Weiss | 2019-01-08 |
| 10172232 | Tamper-respondent assemblies with enclosure-to-board protection | William L. Brodsky, James A. Busby, Edward N. Cohen, Silvio Dragone, Michael J. Fisher +3 more | 2019-01-01 |
| 10172239 | Tamper-respondent sensors with formed flexible layer(s) | John R. Dangler, Phillip Duane Isaacs | 2019-01-01 |
| 10168185 | Circuit boards and electronic packages with embedded tamper-respondent sensor | William L. Brodsky, Silvio Dragone, Roger S. Krabbenhoft, Stefano S. Oggioni, Michael T. Peets +1 more | 2019-01-01 |