Issued Patents 2019
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10395067 | Method of fabricating a tamper-respondent sensor assembly | William L. Brodsky, John R. Dangler, David C. Long, Michael T. Peets | 2019-08-27 |
| 10334722 | Tamper-respondent assemblies | William L. Brodsky, James A. Busby, David C. Long | 2019-06-25 |
| 10331915 | Overlapping, discrete tamper-respondent sensors | William L. Brodsky, John R. Dangler, David C. Long, Michael T. Peets | 2019-06-25 |
| 10257939 | Method of fabricating tamper-respondent sensor | John R. Dangler, David C. Long | 2019-04-09 |
| 10242543 | Tamper-respondent assembly with nonlinearity monitoring | James A. Busby | 2019-03-26 |
| 10237964 | Manufacturing electronic package with heat transfer element(s) | Michael T. Peets, Xiaojin Wei | 2019-03-19 |
| 10217336 | Multi-layer stack with embedded tamper-detect protection | James A. Busby, William Santiago-Fernandez | 2019-02-26 |
| 10169967 | Multi-layer stack with embedded tamper-detect protection | James A. Busby, William Santiago-Fernandez | 2019-01-01 |
| 10172239 | Tamper-respondent sensors with formed flexible layer(s) | John R. Dangler, David C. Long | 2019-01-01 |
| 10169968 | Multi-layer stack with embedded tamper-detect protection | James A. Busby, William Santiago-Fernandez | 2019-01-01 |