Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522398 | Modulating metal interconnect surface topography | Chih-Chao Yang | 2019-12-31 |
| 10468296 | Reducing contact resistance in vias for copper interconnects | Chih-Chao Yang | 2019-11-05 |
| 10446491 | Hybrid interconnects and method of forming the same | Chih-Chao Yang | 2019-10-15 |
| 10424504 | Method for forming improved liner layer and semiconductor device including the same | Chih-Chao Yang | 2019-09-24 |
| 10388615 | Activating reactions in integrated circuits through electrical discharge | Cyril Cabral, Jr., Gregory M. Fritz, Kenneth P. Rodbell | 2019-08-20 |
| 10361115 | Reducing contact resistance in vias for copper interconnects | Chih-Chao Yang | 2019-07-23 |
| 10262955 | Activating reactions in integrated circuits through electrical discharge | Cyril Cabral, Jr., Gregory M. Fritz, Kenneth P. Rodbell | 2019-04-16 |
| 10242943 | Forming a stacked capacitor | Chih-Chao Yang | 2019-03-26 |
| 10170358 | Reducing contact resistance in vias for copper interconnects | Chih-Chao Yang | 2019-01-01 |