Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10466119 | Ruggedized wafer level MEMS force sensor with a tolerance trench | Ian Campbell, Ryan Diestelhorst, Dan Benjamin | 2019-11-05 |
| 10288427 | Integrated motion processing unit (MPU) with MEMS inertial sensing and embedded digital electronics | David Sachs, Babak Taheri | 2019-05-14 |