Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10466119 | Ruggedized wafer level MEMS force sensor with a tolerance trench | Ian Campbell, Ryan Diestelhorst, Steven S. Nasiri | 2019-11-05 |
DB
Dan Benjamin
Overall (2019): #500,438 of 560,194Top 90%
1
Patents 2019