Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10472231 | Assembly and packaging of MEMS device | Brian H. Kim, Haijun She | 2019-11-12 |
| 10351419 | Integrated package containing MEMS acoustic sensor and pressure sensor | Jia Gao, Brian H. Kim, Peter Hartwell | 2019-07-16 |