Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10472231 | Assembly and packaging of MEMS device | Haijun She, Mozafar Maghsoudnia | 2019-11-12 |
| 10351419 | Integrated package containing MEMS acoustic sensor and pressure sensor | Jia Gao, Peter Hartwell, Mozafar Maghsoudnia | 2019-07-16 |