Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10438896 | Interconnecting dies by stitch routing | Zun Zhai | 2019-10-08 |
| 10311938 | Compact system with memory and PMU integration | — | 2019-06-04 |
| 10217708 | High bandwidth routing for die to die interposer and on-chip applications | David A. Secker, Huabo Chen, Zhenggang Cheng | 2019-02-26 |
| 10175744 | Link power savings with state retention | Naveen Cherukuri, Jeffrey R. Wilcox, Venkatraman Iyer, Selim Bilgin, David S. Dunning +2 more | 2019-01-08 |