Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10217708 | High bandwidth routing for die to die interposer and on-chip applications | Sanjay Dabral, David A. Secker, Huabo Chen | 2019-02-26 |
ZC
Zhenggang Cheng
Overall (2019): #201,820 of 560,194Top 40%
1
Patents 2019