Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10283317 | High throughput TEM preparation processes and hardware for backside thinning of cross-sectional view lamella | Paul Keady, Guus Das, Craig Henry, Larry Dworkin, Jeff Blackwood +2 more | 2019-05-07 |
| 10254110 | Via characterization for BCD and depth metrology | Ke Xiao, Timothy A. Johnson | 2019-04-09 |