HK

Hung-Shung Ko

IC Inpaq Technology Co.: 1 patents #3 of 6Top 50%
📍 Keelung, TW: #37 of 96 inventorsTop 40%
Overall (2019): #440,066 of 560,194Top 80%
1
Patents 2019

Issued Patents 2019

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10468378 Method for preparing a semiconductor package Yu-Ming Peng, Chu-Chun Hsu, Hsiu Lun Yeh 2019-11-05