HY

Hsiu Lun Yeh

IC Inpaq Technology Co.: 1 patents #3 of 6Top 50%
📍 Pingzhen District, TW: #11 of 32 inventorsTop 35%
Overall (2019): #440,653 of 560,194Top 80%
1
Patents 2019

Issued Patents 2019

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10468378 Method for preparing a semiconductor package Yu-Ming Peng, Chu-Chun Hsu, Hung-Shung Ko 2019-11-05