Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10431504 | Method of manufacturing semiconductor devices by bonding a semiconductor disk on a base substrate, composite wafer and semiconductor device | Wolfgang Lehnert, Rudolf Berger, Albert Birner, Helmut Brech, Guenther Ruhl +1 more | 2019-10-01 |
| 10388736 | Methods of forming substrate structures and semiconductor components | Gerhard Prechtl, Horst Schafer | 2019-08-20 |
| 10304923 | Method of forming a vertical potential short in a periphery region of a III-nitride stack for preventing lateral leakage | Clemens Ostermaier, Gerhard Prechtl | 2019-05-28 |